Formic acid reduction compatible tabletop vacuum reflow device 'VSS-450-300'
Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!
The "VSS-450-300" is a tabletop vacuum solder reflow device that flexibly accommodates various applications, including solder reflow, oxidation-reduction processing, and paste sintering. With an effective heating area of 300×300×50mm, it can easily handle the mounting of tall components. 【Features】 - Compatible with both fluxless solder (reduction method) and flux-containing solder - Achieves a maximum temperature of 450°C despite its tabletop size - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow - Optional support for formic acid reduction reflow and forming gas (hydrogen + nitrogen) reflow - Supports rapid cooling through a water cooling system *For more details, please refer to the PDF document or feel free to contact us.
- 企業：ユニテンプジャパン
- 価格：Other
